Basic Info

Job Description

Role Overview

Lead and manage research and development activities focused on the design and development of die bonder equipment and high-precision bonding equipment, driving innovation, technical excellence, and new product introduction.

 

Key Responsibilities

R&D Leadership & Technical Excellence

• Lead, manage, and remain hands-on in R&D projects and solution development for new products and technologies.
• Establish core technical competencies within the group and act as a content expert, providing guidance and resolving complex technical challenges.
• Drive new technology pathfinding, innovation, and continuous improvement to enhance product performance and competitiveness.

• Lead team brainstorming sessions for problem-solving, DFMEA, and design reviews.

   

Project & Program Management

• Oversee and manage multiple R&D development programs, ensuring timely and high-quality delivery.
• Define project specifications and schedules by analysing product requirements, estimating timelines, and sequencing project activities.

• Conduct and lead issue investigations and troubleshooting activities, collaborating with cross-functional teams to implement effective solutions.

   

People Development & Collaboration

• Identify team training needs and guide competency development, learning, and career growth within the R&D team.
• Work closely with cross-functional teams to ensure alignment on technical solutions and project execution.

• Foster a collaborative and innovative team culture focused on problem-solving and continuous improvement.

   

Additional Responsibilities

• Undertake other duties and responsibilities as assigned by the Company from time to time, ensuring timely and full closure of all assigned tasks.

Job Requirements

Education

• Bachelor’s degree in Engineering or Science, preferably in Electronics, Electrical, Mechatronics, or Computer Engineering, with Second Upper Class Honours or above.

Experience

• Minimum 7 years of relevant working experience, including experience at a managerial level.
• Proven experience in the design and development of die bonder equipment and high-precision bonding equipment.
• Hands-on experience in R&D, product development, and complex engineering projects.

Technical Skills

• Proficient in SolidWorks or other CAD design tools.
• Strong understanding of precision equipment design and development processes.
• Knowledge of WLCSP (Wafer Level Chip Scale Packaging) with a strategic and innovative mindset is an added advantage.

Leadership & Personal Attributes

• Strong leadership capabilities with proven experience in project and people management.
• Excellent analytical, problem-solving, and decision-making skills.
• Proactive, structured, and results-oriented, with the ability to manage multiple priorities effectively.